About Huihe
投稿者 :
About Huihe 2025年07月29日 19:45:04
No.6978 URL
Headquarters are located in Gangzhou in Jiangxi province, with 12000 ㎡ modern factory building, focus on high-precision multi-layer and special research and development of PCB production, the quantity of 50000 ㎡, marketing center is located in Shenzhen。
PCB blog
投稿者 :
PCB blog 2025年07月29日 19:29:49
No.6976 URL
Huihe Circuit provides news on manufacturing services for PCB or PCBA products in applications such as medical care, aerospace, automotive electronics, military industry, security, new energy, robotics, and rail transit。
Please send the high-resolution image of your circuit board to our personnel for evaluation. Once it is confirmed that the problem is caused by us, we will take responsibility and repair your PCB products. If the problem is not caused by us, our company can provide rework services and charge a reasonable rework fee。
Blind and buried vias supply
投稿者 :
Blind and buried vias supply 2025年07月29日 19:08:36
No.6973 URL
Blind and buried vias supply involves providing PCB components with these specialized vias. Suppliers offer various sizes and qualities, ensuring precise fabrication of vias that connect specific PCB layers, meeting high-density circuit design needs。
Blind and buried vias prototype
投稿者 :
Blind and buried vias prototype 2025年07月29日 19:03:52
No.6972 URL
Blind and buried vias prototypes utilize advanced manufacturing techniques to achieve precise hole placement and optimal interconnects, enhancing the reliability and performance of high-speed electronic systems。
Blind and buried vias price
投稿者 :
Blind and buried vias price 2025年07月29日 18:29:40
No.6971 URL
Blind and buried vias price represents a strategic investment in cutting-edge PCB solutions. By enabling high-speed signal transmission and reducing electromagnetic interference, it is ideal for 5G, AI, and IoT applications, ensuring long-term performance and cost efficiency。
Blind and buried vias manufacturing
投稿者 :
Blind and buried vias manufacturing 2025年07月29日 17:59:32
No.6970 URL
Blind and buried vias manufacturing is a critical process in PCB design, enabling high-density interconnects and improved signal integrity. This technology is essential for modern electronic devices requiring compact and efficient designs。
Blind and Buried Vias Fabrication
投稿者 :
Blind and Buried Vias Fabrication 2025年07月29日 17:55:16
No.6969 URL
Blind and buried vias fabrication specifications cover hole diameter (ranging from 0.075mm for laser – drilled micro-vias to over 0.2mm for mechanical drilling), depth based on layer thickness, and plating thickness (usually 25 – 50μm). Alignment tolerances of ±50μm are common。
